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| DA9278.004 13 July 2006 MAS9278 IC for 10.00 - 30.00 MHz VCXO * * * * * * * * DESCRIPTION The MAS9278 is an integrated circuit well suited to build VCXO for mobile communication. The crystal offset trimming is done through a serial bus and the calibration information is stored in an internal PROM. To build a VCXO only one additional component, a crystal, is needed. Low Power Wide Supply Voltage Range True Sine Wave Output Very High Level of Integration Integrated Varactor Electrically Trimmable Very Low Phase Noise Low Cost FEATURES * * * * * Very small size Minor current draw Wide operating temperature range Phase noise <-130 dBc/Hz at 1 kHz offset Programmable Vc sensitivity APPLICATIONS * * * VCXO for mobile phones VCXO for other telecommunications systems Replacement for TCXO modules BLOCK DIAGRAM VC 2 OUT MAS9278 DA CLK PV VDD Digital 5 2 VSS X1 XO1 X2 1 (5) DA9278.004 13 July 2006 PIN DESCRIPTION Pin Description Power Supply Voltage Serial Bus Data Input Serial Bus Clock Input Programming Input Voltage Control Input Crystal Oscillator Output Power Supply Ground Crystal/Varactor Oscillator Input Buffer Output Symbol VDD DA CLK PV VC X1 VSS X2 OUT x-coordinate 177 435 201 1042 1012 374 830 817 665 y-coordinate 172 1015 1015 1015 158 158 1008 158 1015 Note: Because the substrate of the die is internally connected to GND, the die has to be connected to GND or left floating. Make sure that GND is the first pad to be bonded. Pick-and-place and all component assembly are recommended to be performed in ESD protected area. Note: Pad coordinates are measured from the left bottom corner of the chip to the center of the pads. The coordinates may vary depending on sawing width and location, however, distances between pads are accurate. ABSOLUTE MAXIMUM RATINGS Parameter Supply Voltage Input Voltage Power Dissipation Storage Temperature Note: Not valid for programming pin PV. Symbol VDD - VSS VIN PMAX TST Min -0.3 VSS -0.3 -55 Max 6.0 VDD + 0.3 20 150 Unit V V mW o C Note 1) RECOMMENDED OPERATION CONDITIONS Parameter Supply Voltage Supply Current Operating Temperature Crystal Load Capacitance Symbol VDD ICC TC CL Conditions Vcc = 2.8 Volt -30 7.0 Min 2.7 Typ 2.8 0.85 Max 5.5 +85 Unit V mA o C pF 2 (5) DA9278.004 13 July 2006 ELECTRICAL CHARACTERISTICS (recommended operation conditions) Parameter Frequency Range Voltage Control Range Voltage Control Sensitivity Output Voltage (10k // 10 pF) Compensation CDAC1 (2 Bit) Compensation CDAC2 (4 Bit) Startup Time Symbol fo VC VCSENS Vout CX1 CX2 TSTART Min 10.00 0 Typ Max 30.00 Vdd Unit MHz ppm/V Vpp Note 15..30 1.0 C10 C20 2 C10 + 4.5 C20 + 18 1) 2) 3) pF pF ms Note 1: programmable by DN/DP switches Note 2: typ C10 = 4.5 pF Note 3: typ C20 = 12.5 pF IC OUTLINES CLK DA OUT VSS PV 1182 m MAS9278 VDD X1 X2 VC Die map reference 1200 m Note 1: MAS9278 pads are round with 80 m diameter at opening. Note 2: Pins CLK and DA can either be connected to VSS or left floating and pin PV can either be connected to VDD or left floating in VCXO module end-user application. Note 3: Die map reference is the actual left bottom corner of the sawn chip. 3 (5) DA9278.004 13 July 2006 SAMPLES IN SB20 DIL PACKAGE 1 2 3 4 MAS9278 YYWW XXXXX.X 20 VDD 19 18 CLK 17 DA 16 OUT 15 GND 14 13 12 PV 11 X1 5 6 Top marking: YYWW = Year, Week XXXXX.X = Lot number X2 7 8 9 VC 10 4 (5) DA9278.004 13 July 2006 ORDERING INFORMATION Product Code MAS9278ATG1 MAS9278A MAS9278B1TG00 Version A A B Package EWS tested wafers 215 m SMD Package TBD EWS tested wafers 215 m Comments Larger range of VC sensitivity Larger range of VC sensitivity Smaller range of VC sensitivity See DAE9278 page 4 for definition of versions. Please contact Micro Analog Systems Oy for other wafer thickness options. LOCAL DISTRIBUTOR MICRO ANALOG SYSTEMS OY CONTACTS Micro Analog Systems Oy Kamreerintie 2, P.O. Box 51 FIN-02771 Espoo, FINLAND Tel. +358 9 80 521 Fax +358 9 805 3213 http://www.mas-oy.com NOTICE Micro Analog Systems Oy reserves the right to make changes to the products contained in this data sheet in order to improve the design or performance and to supply the best possible products. Micro Analog Systems Oy assumes no responsibility for the use of any circuits shown in this data sheet, conveys no license under any patent or other rights unless otherwise specified in this data sheet, and makes no claim that the circuits are free from patent infringement. Applications for any devices shown in this data sheet are for illustration only and Micro Analog Systems Oy makes no claim or warranty that such applications will be suitable for the use specified without further testing or modification. 5 (5) |
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